• DocumentCode
    2979354
  • Title

    Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect

  • Author

    Daniel, Luca ; Sangiovanni-Vincentelli, Alberto ; White, Jacob

  • Author_Institution
    MIT, MA, USA
  • fYear
    2002
  • fDate
    10-14 Nov. 2002
  • Firstpage
    326
  • Lastpage
    333
  • Abstract
    Modeling the exponentially varying current distributions in conductor interiors associated with high frequency interconnect behavior causes a rapid increase in the computation time and memory required even by recently developed fast electromagnetic analysis programs. In this paper we describe a procedure to generate numerically a set of basis functions which efficiently represent conductor current variation, and thus improving solver efficiency. The method is based on solving a sequence of template problems, and is easily generalized to arbitrary conductor cross-sections. Results are presented to demonstrate that the numerically computed basis functions are seven to twenty times more efficient than the commonly used piece-wise constant basis functions.
  • Keywords
    circuit CAD; circuit simulation; computational electromagnetics; conductors (electric); integrated circuit design; integrated circuit interconnections; integrated circuit modelling; printed circuit design; skin effect; arbitrary conductor cross-sections; conductor current variation representation; conductor interior exponentially varying current distributions; electromagnetic analysis programs; high frequency interconnects; interconnect analysis; numerically generated basis functions; package skin/proximity effect modeling; parasitic extraction; piece-wise constant basis functions; proximity templates; solver efficiency; template problem sequential solution; Analytical models; Clocks; Computational modeling; Conductors; Frequency; Integrated circuit interconnections; Jacobian matrices; Packaging; Proximity effect; Skin effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2002. ICCAD 2002. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-7607-2
  • Type

    conf

  • DOI
    10.1109/ICCAD.2002.1167554
  • Filename
    1167554