Increased lifetime of wire bonding connections for IGBT power modules

Author

Hamidi, A. ; Kaufmann, S. ; Herr, E.

Author_Institution

ABB Corp. Res. ltd., Baden-Dattwil, Switzerland

Volume

2

fYear

2001

fDate

2001

Firstpage

1040

Abstract

In power transmission, industrial and traction applications IGBT modules are required to reach a high lifetime while operating under severe working conditions and in harsh environments. Therefore, ABB is taking care of reliability and lifetime requirements at the early stages of the modules´ packaging design and development. This paper deals with the wire bonding interconnection technology used in power IGBT modules and the specific failures related to thermal fatigue phenomena. A technology comparison is performed for wire bonding: with and without a polymer bond coating as well as bonding on strain buffer. The potential of these different technologies to enhance reliability and lifetime is assessed

Keywords

insulated gate bipolar transistors; interconnections; lead bonding; multichip modules; reliability; semiconductor device packaging; thermal analysis; thermal stress cracking; IGBT modules; IGBT power modules; harsh environments; high lifetime; lifetime improvement; lifetime requirements; multichip modules; packaging design; polymer bond coating; power IGBT modules; power transmission; reliability; severe working conditions; strain buffer bonding; thermal fatigue phenomena; wire bonding; wire bonding connections; wire bonding interconnection technology; Bonding; Capacitive sensors; Coatings; Employee welfare; Fatigue; Insulated gate bipolar transistors; Packaging; Polymer films; Power transmission; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2001. APEC 2001. Sixteenth Annual IEEE

Conference_Location

Anaheim, CA

Print_ISBN

0-7803-6618-2

Type

conf

DOI

10.1109/APEC.2001.912494

Filename

912494