DocumentCode
2980227
Title
Product-oriented BGA manufacturability and reliability study
Author
Oberlin, B. ; Chung, Tom
Author_Institution
Tandem Comput. Inc., Cupertino, CA, USA
fYear
1997
fDate
13-15 Oct 1997
Firstpage
352
Lastpage
357
Abstract
Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology
Keywords
lithography; manufacture; packaging; reliability; technological forecasting; testing5794829; BGA package; manufacturability; product-oriented test board; reliability; Assembly; Ceramics; Electric shock; Electronic equipment testing; Manufacturing; Modular construction; Plastic packaging; Production; Soldering; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-3929-0
Type
conf
DOI
10.1109/IEMT.1997.626944
Filename
626944
Link To Document