Title :
Aluminium Incorporation in Lanthanum Oxide Films by using Plasma Immersion Ion Implantation
Author :
Sen, Banani ; Yang, B.L. ; Wong, Hei ; Chu, P.K. ; Huang, A. ; Kakushima, K. ; Iwai, H.
Author_Institution :
City Univ. of Hong Kong, Kowloon
Abstract :
The physics and the effects of aluminium incorporation into lanthanum oxide (La2O3) films were studied by using x-ray photoelectron spectroscopy and electrical measurements. We found that trace amount (5% ) of aluminium incorporation in lanthanum oxide film can suppress the leakage current effectively. The bulk oxide traps and interface traps can also reduced. The percentage of aluminium incorporation into the La2O3 films by plasma immersion ion-implantation needs to be optimized to have the maximum reduction of oxide traps and to maintain the lowest leakage current.
Keywords :
X-ray spectroscopy; aluminium; lanthanum compounds; plasma immersion ion implantation; aluminium incorporation; electrical measurement; interface trap; lanthanum oxide film; leakage current suppression; oxide trap; plasma immersion ion implantation; x-ray photoelectron spectroscopy; Aluminum; Dielectric films; Dielectric materials; Dielectrics and electrical insulation; Electric variables measurement; Lanthanum; Leakage current; Plasma immersion ion implantation; Plasma temperature; Silicon; aluminium; lanthanum oxide; plasma immersion ion implantation; x-ray photoelectron spectroscopy;
Conference_Titel :
Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-0637-1
Electronic_ISBN :
978-1-4244-0637-1
DOI :
10.1109/EDSSC.2007.4450090