DocumentCode :
2980907
Title :
Experimental verification of Single Event interconnect crosstalk in a 90 nm CMOS technology
Author :
Balasubramanian, A. ; Amusan, O.A. ; Bhuva, B.L. ; Reed, R.A. ; Sternberg, A.L. ; Massengill, L.W. ; McMorrow, D. ; Nation, S.A. ; Melinger, J.S.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
fYear :
2007
fDate :
10-14 Sept. 2007
Firstpage :
1
Lastpage :
7
Abstract :
The presence of Single Event (SE) interconnect crosstalk has been demonstrated experimentally in the IBM 90 nm CMOS9SF process. Single and Two Photon pulsed laser experiments were performed to demonstrate this phenomenon. 3D mixed-mode simulations and modeling show SE interconnect crosstalk to depend on the interconnect length and on the amount of deposited charge. Simulations have been performed at the dual operating voltages used in this technology. Experimental and accompanying simulation results show this effect to increase SE susceptibility by increasing the vulnerable area and require evaluation to assure expected hardness levels.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated circuit noise; radiation effects; CMOS integrated circuits; single event interconnect crosstalk; single event susceptibility; size 90 nm; CMOS technology; Capacitance; Computational modeling; Crosstalk; Integrated circuit interconnections; Optical pulses; Pulsed laser deposition; Radiation hardening; Single event upset; Voltage; complementary metal-oxide-semiconductor (CMOS); interconnect crosstalk; single event (SE); technology computer aided design (TCAD);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation and Its Effects on Components and Systems, 2007. RADECS 2007. 9th European Conference on
Conference_Location :
Deauville
ISSN :
0379-6566
Print_ISBN :
978-1-4244-1704-9
Type :
conf
DOI :
10.1109/RADECS.2007.5205507
Filename :
5205507
Link To Document :
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