DocumentCode :
2981212
Title :
Erosion behaviour and `erodibility´ of Ag/CdO and Ag/SnO2 contacts under AC 3 and AC 4 test conditions
Author :
Manhart, H. ; Rieder, W.
Author_Institution :
Dept. of Switching Devices, Tech. Univ. of Vienna, Austria
fYear :
1989
fDate :
18-20 Sep 1989
Firstpage :
43
Lastpage :
52
Abstract :
Contact erosion depends on both the duration and efficiency of interaction between arc and contacts. The arc motion in a magnetic field was recorded, and the material loss caused by arc erosion was weighed. The material loss related to 1 ms of arc interaction, called erodibility, was evaluated for the contact materials Ag/CdO and Ag/SnO 2. All tests were performed in one type of commercial contactor (rated current 110 A). The erodibility was determined for new and partly eroded contacted prestressed during life tests under AC 3 and AC 4 conditions according to IEC test specification 158-1. AC 4 erosion was mainly caused by break arcs, but the effect of make arcs was negligible, whereas AC 3 erosion was due to both break and make arcs. The latter were more effective in Ag/SnO2 contacts. After AC 3 life tests the erodibility values determining the erosion of Ag/SnO 2 contacts at the site of arc formation were higher than those of Ag/CdO; after AC 4 life tests, however, there was hardly any difference between the erodibilities of the two materials
Keywords :
cadmium compounds; circuit-breaking arcs; composite materials; electrical contacts; life testing; materials testing; silver; tin compounds; AC 3 test conditions; AC 4 test conditions; Ag-CdO contact materials; Ag-SnO2 contact materials; IEC test specification; arc ability; arc commutation; arc erosion; arc motion; break arcs; contact erosion; contactor; erodibility; life tests; magnetic field; make arcs; material loss; Current supplies; IEC; Life testing; Materials testing; Particle scattering; Performance evaluation; Solids; Stress; TV; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1989., Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/HOLM.1989.77905
Filename :
77905
Link To Document :
بازگشت