• DocumentCode
    2981861
  • Title

    Processing and properties of high aspect ratio ferroelectric structures

  • Author

    Bharadwaja, S.S.N. ; Won, D.J. ; Fang, Haiyang ; Gopalan, V. ; Trolier-McKinstry, Susan

  • Author_Institution
    Mater. Res. Inst., Pennsylvania State Univ., PA, USA
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    189
  • Lastpage
    192
  • Abstract
    High aspect ratio (≥50:1) ferroelectric structures are potentially applicable in areas such as tunable photonic devices, sensors and actuators. In this work high aspect ratio structures of Pb(Zrx, Ti1-x)O3, and LaNiO3/Pb(Zrx,Ti1-x)O3/LaNiO3 tri-layers were prepared by vacuum infiltration of meso-porous Si templates. Pyrolysis was done at 300°C for 2 min. Reactive ion etching followed by XeF2 isotropic Si etching was utilized to release the embedded PZT structures from the Si template. The released structures were annealed at 700°C for 1 min. in order to induce crystallization. These 2D ferroelectric photonic structures exhibited a TE-mode band gap in the infrared region between 4.0 - 4.4 microns in wavelength, which was found to be consistent with the theoretical photonic band gap calculations.
  • Keywords
    annealing; crystallisation; ferroelectric materials; lanthanum compounds; lead compounds; photonic band gap; pyrolysis; sputter etching; 1 min; 2 min; 300 degC; 4.0 to 4.4 micron; 700 degC; LaNiO3-Pb(ZrxTi1-x)O3-LaNiO3; Si; TE-mode band gap; actuators; annealing; aspect ratio ferroelectric structures; crystallization; ferroelectric photonic structures; infrared region; isotropic etching; mesoporous templates; photonic band gap; pyrolysis; reactive ion etching; sensors; tunable photonic devices; vacuum infiltration; Crystalline materials; Crystallization; Etching; Fabrication; Ferroelectric materials; Nanostructured materials; Nanostructures; Optoelectronic and photonic sensors; Photonic band gap; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 2004. ISAF-04. 2004 14th IEEE International Symposium on
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-8410-5
  • Type

    conf

  • DOI
    10.1109/ISAF.2004.1418368
  • Filename
    1418368