• DocumentCode
    2982197
  • Title

    Compound Semiconductor as CMOS Channel Material: DéjÃ\xa0 vu or New Paradigm?

  • Author

    Datta, Suman

  • Author_Institution
    Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA
  • fYear
    2008
  • fDate
    23-25 June 2008
  • Firstpage
    33
  • Lastpage
    36
  • Abstract
    We have examined the potential of double gate (DG) inter-band tunnel FETs (TFET) in 3 different material systems, Si, Ge and InAs, for logic circuit applications down to 0.25 V supply voltage (VCC). Based on the two-dimensional numerical drift-diffusion simulations, we conclude that 30 nm gate length InAs (indium arsenide) based TFETs can achieve Ion/Ioff of > 4x104 with < 1 ps intrinsic delay at 0.25 V VCC. In fact, the InAs TFETs show the maximum benefit when their supply voltage VCC is scaled aggressively down to 0.25 V and this benefit primarily arises from a) efficient tunneling under low electric field and b) their higher source-side injection velocity. MOSFETs or quantum-well FETs in this low VDD range do not even meet the Ion-Ioff stipulation of 104.
  • Keywords
    CMOS integrated circuits; MOSFET; narrow band gap semiconductors; semiconductor quantum wells; tunnelling; CMOS channel material; MOSFET; TFET; double gate inter-band tunnel FETs; interband tunneling structure; logic circuit applications; nanoelectronics; narrow bandgap compound semiconductor based transistors; quantum-well FETs; quantum-well architecture; source-side injection velocity; supply voltage; two-dimensional numerical drift-diffusion simulations; ultralow power information processing; Circuit simulation; Delay; Double-gate FETs; Indium; Logic circuits; MOSFETs; Numerical simulation; Semiconductor materials; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2008
  • Conference_Location
    Santa Barbara, CA
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4244-1942-5
  • Electronic_ISBN
    1548-3770
  • Type

    conf

  • DOI
    10.1109/DRC.2008.4800724
  • Filename
    4800724