Implement of an Improvement Particle Monitoring Methodology in an Industry Production Process

For the manufacturing of submicron or deep submicron ULSIs, it is important to completely suppress particles and contamination created on the silicon wafer surface. The time and logistics associated with particle testing on product have driven manufacturing to find fast and effective monitoring techniques that can deliver high manufacturing efficiency at lower cost. Using particle monitoring is an accurate and cost effective method of contamination control in a production environment. In general, the traditional method is using 2 pieces control wafers (top and bottom) in slot position to monitor production environment. In this work, an improvement method was proposed to implement using 6-pieces control wafers replacing the traditional method (2 pieces). The experimental results shown that the improvement method has 7 times sensitive efficiencies than the traditional one.