Simulation on Vertical Via Interconnection Using Matrix-penciled Moment Method in Microwave Multi-Chip Module

Author

Wu-sheng, Ji ; Jian-Kang, Xiao ; Yong-jun, Xie

Author_Institution

Xidian Univ., Xian

fYear

2007

fDate

18-21 April 2007

Firstpage

1

Lastpage

4

Abstract

In the multi-chip module, signal transmission lines such as striplines or microstrip lines at different layers are connected through vias. It is very important to research the characteristics of via because of the signal transmission discontinuity it induced. In this paper, the matrix-penciled moment method is applied to analyze and compute the scattering parameters of via in a multi-layered module, and some important laws of scattering characteristics of the via are obtained, and the correctness of the calculated results are demonstrated as well.

Keywords

integrated circuit interconnections; microwave integrated circuits; multichip modules; matrix-penciled moment method; microwave multi-chip module; signal transmission lines; vertical via interconnection; Distributed parameter circuits; Electromagnetic scattering; Electromagnetic waveguides; Integrated circuit interconnections; Microwave theory and techniques; Moment methods; Scattering parameters; Transmission line antennas; Transmission line matrix methods; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology, 2007. ICMMT '07. International Conference on

Conference_Location

Builin

Print_ISBN

1-4244-1049-5

Electronic_ISBN

1-4244-1049-5

Type

conf

DOI

10.1109/ICMMT.2007.381405

Filename

4266164