Research on the electrical performance of BGA package in RL application

With the increase of the working frequency, package density and complexity, the impact of package on device´s performance can not be neglected anymore. BGA is very popular due to its advantages which allow for higher pin counts, higher electrical and thermal performance and higher interconnect density; can meet the specifications of the next generation wireless communication systems, especially the use in RF module. In this paper the requirement of RF package is introduced in brief, and then the author focus on the simulation and analysis of the electrical performance of BGA package in RF application.