Title :
Spatial resistivity profiling of multilayer capacitors as a function of furnace atmosphere
Author :
Williams, C.M. ; Hydrick, A.E. ; Schulze, H.M. ; Schulze, W.A.
Author_Institution :
New York State Coll. of Ceramics, Alfred Univ., NY, USA
Abstract :
The research preformed was designed to discover what specific aspects of furnace control or sintering atmospheres cause a multilayer capacitor (MLC) to degrade and fail under typical usage conditions and typical HALT conditions. Reliability problems were assumed to relate to furnace atmosphere and burn-in testing. MgTiO3 and commercial X7R BaTiO3 MLCs were used in this study. These samples were initially examined in their as received state using a semiconductor probing station adapted for use as a DC high resistivity profiling device. The samples were then annealed in various partial pressures of oxygen (PO2) in an effort to alter oxygen vacancy concentration and change the density of charge carriers in the samples. Using DC profiling, it was found that there was a decrease in the insulation resistance of the dielectric material as samples were reduced in low PO2 atmospheres. This was thought to be a possible source of life test failure. After reduction the BaTiO3 MLCs were re-oxidized in air for varying lengths of time and then profiled before HALT tested.
Keywords :
annealing; barium compounds; capacitors; dielectric materials; electrical resistivity; furnaces; magnesium compounds; oxidation; vacancies (crystal); BaTiO3; DC high resistivity profiling device; HALT; MgTiO3; annealing; charge carrier density; dielectric material; furnace atmosphere; furnace control; insulation resistance; life test failure; multilayer capacitors; oxygen vacancy concentration; reliability; semiconductor probing station; sintering atmospheres; spatial resistivity profiling; Annealing; Atmosphere; Capacitors; Charge carriers; Conductivity; Degradation; Dielectrics and electrical insulation; Furnaces; Nonhomogeneous media; Testing;
Conference_Titel :
Applications of Ferroelectrics, 2004. ISAF-04. 2004 14th IEEE International Symposium on
Print_ISBN :
0-7803-8410-5
DOI :
10.1109/ISAF.2004.1418404