DocumentCode :
2982919
Title :
Mix-mode Crack Growth Intelligence Analysis and Simulation Module Development Based on UIDL and APDL
Author :
Sun, Yuantao ; Zhang, Qin
Author_Institution :
Coll. of Mech. Eng., Tongji Univ., Shanghai, China
fYear :
2010
fDate :
25-27 June 2010
Firstpage :
1276
Lastpage :
1279
Abstract :
As a main defect, the crack has enormous threat on structure safety, which the great majority is mix-mode in engineering. At present, mix-mode crack analysis mainly depend on the manpower way to rebuilt continuously crack structure one by one to simulate the process of crack growth. And the process of modeling crack structure also is complex. To improve the analysis efficiency and provide fast decision support for the engineer, the paper put forward the method to construct the mix-mode crack growth intelligence analysis and simulation module based on UIDL and APDL. So that the user easily built crack model on the base of origin structure (non-crack) through the module. And then the growth analysis and simulation can be automatically accomplished through the module according to the theory of fracture mechanics intelligently. In the paper, the module development method how to integrate UIDL and APDL into finite element software Ansys to generate costumed program to analyze crack growth is described detail. An example illustrated proved the module valid in the end.
Keywords :
cracks; decision support systems; finite element analysis; fracture mechanics; interactive programming; mechanical engineering computing; user interfaces; APDL; Ansys; UIDL; crack structure; decision support; finite element software; fracture mechanics; mix mode crack growth intelligence analysis; simulation module development; structure safety; Analytical models; Finite element methods; Load modeling; Software; Stress; Sun; User interfaces; APDL; UIDL; crack propagation; module; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Control Engineering (ICECE), 2010 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-6880-5
Type :
conf
DOI :
10.1109/iCECE.2010.317
Filename :
5630033
Link To Document :
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