Title :
Study of Ion-implanted InSb1-xNx Alloys using Secondary Ion Mass Spectroscopy
Author :
Wang, Y. ; Zhang, D.H. ; Huang, Z.M. ; Liu, W. ; Li, J.H. ; Liu, C.J. ; Wee, A.T.S.
Author_Institution :
Nanyang Technol. Univ., Singapore
Abstract :
Due to the band anti-crossing effect by the high-lying nitrogen (N) resonant state, the InSbN alloys show markedly smaller energy band gap. This, together with their long Auger life, makes the alloys the best candidate for long wavelength infrared. We have fabricated a set of InSbN alloys by directly nitrogen implantation into the InSb substrate and characterize them with various facilities after annealing at different temperatures for different periods of time. The secondary ion mass spectrometry indicates that nitrogen atoms in the InSbN alloys are not stable but diffuse significantly. The projected range Rp in the Fick´s second law is modified to be Rp = partt, where part is a constant value which depends on the material condition and the annealing temperature. The diffusion coefficient is determined by fitting the concentration profiles and it can be described by an exponential relation with a constant D0 of 10-10 cm2/m and an activation energy of 0.55 eV, indicating an interstitial dominant diffusion process. A dominant tendency for surface nitrogen build-up was observed.
Keywords :
III-V semiconductors; annealing; antimony compounds; diffusion; indium compounds; interstitials; ion implantation; nitrogen; optical materials; secondary ion mass spectroscopy; Fick´s second law; InSb1-xNx; N; activation energy; annealing; band anti-crossing effect; diffusion coefficient; directly nitrogen implantation; electron volt energy 0.55 eV; energy band gap; exponential relation; high-lying nitrogen resonant state; interstitial dominant diffusion process; ion-implantation; long Auger life; secondary ion mass spectroscopy; Annealing; Atomic layer deposition; Atomic measurements; Ion implantation; Mass spectroscopy; Nitrogen; Plasma temperature; Resonance; Temperature dependence; Temperature distribution;
Conference_Titel :
Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-0637-1
Electronic_ISBN :
978-1-4244-0637-1
DOI :
10.1109/EDSSC.2007.4450216