Title :
High density focal plane signal processing using 3-D vertical interconnects
Author :
Buchanan, B. ; Camperi-Ginestet, C. ; Morris, T. ; Brooke, M. ; DeWeerth, S. ; Jokerst, N. ; Allen, M.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to a logarithmically encoded frequency signal
Keywords :
III-V semiconductors; array signal processing; focal planes; gallium arsenide; image processing equipment; integrated circuit interconnections; optical interconnections; p-i-n photodiodes; 3D vertical interconnects; GaAs; P-i-N photodetectors; focal plane processor; focal plane signal processing; incident light intensity; logarithmically encoded frequency signal; optical interconnects; Array signal processing; Integrated circuit interconnections; Integrated circuit technology; Optical device fabrication; Optical interconnections; Optical signal processing; Photodetectors; Signal processing; Silicon; Substrates;
Conference_Titel :
Circuits and Systems, 1994., Proceedings of the 37th Midwest Symposium on
Conference_Location :
Lafayette, LA
Print_ISBN :
0-7803-2428-5
DOI :
10.1109/MWSCAS.1994.519220
