• DocumentCode
    2983358
  • Title

    Sub-500 ps 64 b ALUs in 0.18 /spl mu/m SOI/bulk CMOS: Design & scaling trends

  • Author

    Mathew, S. ; Krishnamurthy, R. ; Anders, M. ; Rios, R. ; Mistry, K. ; Soumyanath, K.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    2001
  • fDate
    7-7 Feb. 2001
  • Firstpage
    318
  • Lastpage
    319
  • Abstract
    The requirements of high-throughput Internet servers necessitate the use of multiple ALUs in high-performance 64 b execution cores. Consequently, each ALU demands a compact, energy-efficient 64 b adder core with single-cycle latency. The resultant critical path, which is a balanced mix of interconnect, diffusion and gate loads, forms a representative test bed for evaluating competing circuit techniques and process technologies (bulk CMOS/SOI). This paper presents: (i) the design of an energy-efficient 64 b ALU in 0.18 /spl mu/m bulk CMOS technology; (ii) a direct port of this design to a comparable SOI technology and (iii) an SOI-optimal redesign of the adder core. Further, it describes design margining required for the SOI implementations and reports the results of shrinking the two architectures to 0.13 /spl mu/m Bulk/SOI. In both cases, a sophisticated SOI compact model that incorporates features to effectively model the SOI floating body effect is used.
  • Keywords
    CMOS logic circuits; adders; integrated circuit design; silicon-on-insulator; 0.13 micron; 0.18 micron; 500 ps; 64 bit; ALU; Internet server; SOI/bulk CMOS technology; adder; design scaling; floating body effect; Adders; CMOS process; CMOS technology; Circuit testing; Clocks; Energy efficiency; Integrated circuit interconnections; Internet; Multiplexing; Parasitic capacitance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-6608-5
  • Type

    conf

  • DOI
    10.1109/ISSCC.2001.912655
  • Filename
    912655