DocumentCode
2983594
Title
Bond process monitoring via self-sensing piezoelectric transducers
Author
Brökelmann, Michael ; Wallaschek, Jörg ; Hesse, Hans
Author_Institution
Heinz Nixdorf Inst., Paderborn Univ., Germany
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
125
Lastpage
129
Abstract
Process monitoring via self-sensing piezoelectric transducers was applied to wire bonding. Starting with a description of the state of the art in bond process monitoring this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.
Keywords
lead bonding; piezoelectric transducers; process monitoring; bond process monitoring; self-sensing piezoelectric transducers; wire bonding; Automotive applications; Bonding; Condition monitoring; Manufacturing; Piezoelectric transducers; Production; Safety; Space technology; Welding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
ISSN
1075-6787
Print_ISBN
0-7803-8414-8
Type
conf
DOI
10.1109/FREQ.2004.1418440
Filename
1418440
Link To Document