Title :
High pin count BGA board level assembly
Author :
Mendez, David M.
Author_Institution :
Solectron Texas, Austin, TX, USA
Abstract :
Successful processing of high pin count Ball Grid Array (BGA) components through an assembly operation is dependant upon many factors including solder paste deposition, component placement, and quality of the raw materials including the printed wiring boards (PWB) and the BGA components
Keywords :
assembling; integrated circuit packaging; printed circuit manufacture; soldering; surface mount technology; BGA board level assembly; assembly operation; component placement; pin count; printed wiring boards; raw material quality; solder paste deposition; Assembly; Bridges; Coordinate measuring machines; Electronics packaging; Inspection; Lead; Printers; Printing; Robustness; X-ray lasers;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626962
