Title :
Interaction between thermal impedance and parasitics in power sections
Author :
Förster, Stefan ; Lindemann, Andreas
Author_Institution :
Otto-von-Guericke-Univ. Magdeburg, Magdeburg
Abstract :
Considerations refer to thermal optimisation and its coherence with the appearance of electrical parasitics in power electronic systems. Analytical and finite element simulation assisted analysis of thermal resistance depending on geometry of layered assemblies is discussed. Resulting approach provides a basis for considerations on parasitics applying partial element equivalent circuit method (PEEC).
Keywords :
equivalent circuits; finite element analysis; power electronics; thermal analysis; thermal management (packaging); thermal resistance; finite element simulation; packaging system; partial element equivalent circuit method; power electronic systems; power section parasitics; thermal impedance; thermal optimisation; thermal resistance; Analytical models; Assembly; Circuit simulation; Electric resistance; Finite element methods; Geometry; Impedance; Power electronics; Solid modeling; Thermal resistance; Packaging; System Integration; Thermal Design;
Conference_Titel :
Power Electronics and Motion Control Conference, 2008. EPE-PEMC 2008. 13th
Conference_Location :
Poznan
Print_ISBN :
978-1-4244-1741-4
Electronic_ISBN :
978-1-4244-1742-1
DOI :
10.1109/EPEPEMC.2008.4635626
