• DocumentCode
    2984700
  • Title

    Silicon carbide Schottky diodes and MOSFETs: Solutions to performance problems

  • Author

    Guy, Owen J. ; Lodzinski, Michal ; Castaing, Ambroise ; Igic, P.M. ; Perez-Tomas, Amador ; Jennings, Michael R. ; Mawby, Philip A.

  • Author_Institution
    Sch. of Eng., Swansea Univ., Swansea
  • fYear
    2008
  • fDate
    1-3 Sept. 2008
  • Firstpage
    2464
  • Lastpage
    2471
  • Abstract
    Silicon carbide has long been hailed as the successor to silicon in many power electronics applications. Its superior electrical and thermal properties have delivered devices that operate at higher voltages, higher temperatures and with lower on-resistances than silicon devices. However, SiC Schottky diodes are still the only devices commercially available today. Though SiC Schottkys are now being used with silicon IGBTs in dasiahybridpsila inverter modules, the real advantages will be seen when silicon switching devices can be replaced by SiC. This paper describes the current state of SiC diode and MOSFET technology, discussing possible solutions to making these devices commercially viable.
  • Keywords
    Schottky diodes; insulated gate bipolar transistors; invertors; power MOSFET; power bipolar transistors; silicon compounds; switching circuits; thermal properties; IGBT; MOSFET; SiC; electrical properties; hybrid inverter modules; power electronics applications; silicon carbide schottky diodes; silicon switching devices; thermal properties; Consumer electronics; Leakage current; MOSFETs; Schottky barriers; Schottky diodes; Semiconductor diodes; Silicon carbide; Temperature sensors; Virtual reality; Voltage; High temperature electronics; MOSFET; New switching devices; Power semiconductor device; Silicon Carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Motion Control Conference, 2008. EPE-PEMC 2008. 13th
  • Conference_Location
    Poznan
  • Print_ISBN
    978-1-4244-1741-4
  • Electronic_ISBN
    978-1-4244-1742-1
  • Type

    conf

  • DOI
    10.1109/EPEPEMC.2008.4635633
  • Filename
    4635633