Advanced Enhanced High Heat Dissipation Package Structures

In high power density and deep sub-micron of package fabrications, it is difficult to maintain high heat dissipation on device; because of the higher pattern density and IO on IC design. A package with high heat dissipation, comprising a carrier and a chip located thereon, with electrical connection between the chip to the carrier. A molding compound is used to encapsulate the chip and the carrier. A heat pipe is provided such that one end thereof is embedded in the molding compound, is closed to the active surface of the chip and substantially normal to the chip, and the other end thereof is extended outside of the molding compound. More specifically, the present invention and study relate to a semiconductor package with heat dissipation.