DocumentCode
2985019
Title
Benchmarking reliability tests for plastic laminate modules
Author
Roesch, William J. ; Byrd, Dee H.
Author_Institution
TriQuint Semicond. Inc., Hillsboro, OR, USA
fYear
2002
fDate
20 Oct. 2002
Firstpage
69
Lastpage
77
Abstract
The high volume commercial application for compound semiconductors (at the moment) is cellular phones. Several hundred million wireless phones are being manufactured every year with radios enabled by compound semiconductor amplifiers, receivers, and switches. Recently, portions of these radios have been simplified and compressed into "modules." This packaging transformation may have special reliability concerns that are the subject of this work. An investigation was made into the reliability aspects of modules. Customer requirements were collected and leading suppliers were interviewed for their insight.
Keywords
laminates; modules; plastic packaging; reliability; testing; plastic laminate modules; reliability test benchmarking; Assembly; Benchmark testing; Cellular phones; Inductors; Laminates; Manufacturing; Plastics; Substrates; Transmission line matrix methods; X-rays;
fLanguage
English
Publisher
ieee
Conference_Titel
GaAs Reliability Workshop, 2002
Print_ISBN
0-7908-0103-5
Type
conf
DOI
10.1109/GAAS.2002.1167867
Filename
1167867
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