• DocumentCode
    298507
  • Title

    Environmental and health aspects of CIS-module production, use and disposal

  • Author

    Thumm, Werner ; Finke, Andreas ; Neumeier, Birgit ; Beck, Barbara ; Kettrup, Antonius ; Steinberger, Hartmut ; Moskowitz, Paul D.

  • Author_Institution
    Inst. of Ecological Chem., Neuherberg, Germany
  • Volume
    1
  • fYear
    1994
  • fDate
    5-9 Dec 1994
  • Firstpage
    262
  • Abstract
    Copper indium diselenide (CIS) is one of the most promising compounds in thin film technology. Since there is scant information available about environmental and health hazards, a study was initiated to characterize risks associated with the production, use and disposal of thin film photovoltaic modules. Data available from literature and developers of this technology contribute to an assessment of potential risks during production. In laboratory experiments the release of hazardous materials during operation caused by accidents or false handling and after disposal are simulated. In biological experiments the possible impact on living matter is established. These experiments comprise toxicity tests with aquatic organisms and rats representing mammals
  • Keywords
    accidents; copper compounds; health hazards; indium compounds; semiconductor materials; semiconductor thin films; solar cell arrays; solar cells; ternary semiconductors; waste disposal; CuInSe2; CuInSe2 modules; aquatic organisms; biological experiments; disposal; environmental hazards; false handling; hazardous materials release; health hazards; living matter; potential risks; rats; solar cell modules; thin film photovoltaic modules; thin film technology; toxicity tests; Computational Intelligence Society; Copper; Hazardous materials; Hazards; Indium; Laboratories; Photovoltaic systems; Production; Solar power generation; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    0-7803-1460-3
  • Type

    conf

  • DOI
    10.1109/WCPEC.1994.519858
  • Filename
    519858