Verification of electronic material properties and characterization of electronic component failures

Author

Zinger, Paul C. ; Dobbs, Bill ; White, Eddie L. ; Marchese, Michael J. ; Slenski, George A.

Author_Institution

Southwestern Ohio Council for Higher Educ., Wright-Patterson AFB, OH, USA

fYear

1988

fDate

23-27 May 1988

Firstpage

1160

Abstract

The relationship between failure analysis/fault isolation and improvements in reliability and maintainability of electronic hardware is discussed. How failure analysis is an essential part of improving electronic hardware integrity and system life is examined. Three studies are presented as examples of how recommendations determined by failure investigations can eliminate recurring problems in hardware and can increase system reliability. The discussion covers manufacturing improvements: on gimbal potentiometers, on two types of electronic hybrid modules, and on HEXFET technology power transistors

Keywords

aircraft instrumentation; failure analysis; fault location; insulated gate field effect transistors; military equipment; modules; potentiometers; power transistors; reliability; HEXFET technology power transistors; air force; electronic component failures; electronic hardware; electronic hardware integrity; electronic hybrid modules; electronic material properties; failure analysis; fault isolation; gimbal potentiometers; maintainability; manufacturing; system life; system reliability; Electronic components; Failure analysis; Hardware; Laboratories; Manufacturing; Material properties; Optical microscopy; Potentiometers; Scanning electron microscopy; Transmission electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace and Electronics Conference, 1988. NAECON 1988., Proceedings of the IEEE 1988 National

Conference_Location

Dayton, OH

Type

conf

DOI

10.1109/NAECON.1988.195152

Filename

195152