• DocumentCode
    2985699
  • Title

    Influence of mechanical design parameters on electrical contact performance

  • Author

    Olsson, K.-E. ; Öberg, A.

  • Author_Institution
    ABB Power Syst. AB, Ludvika, Sweden
  • fYear
    1989
  • fDate
    18-20 Sep 1989
  • Firstpage
    133
  • Lastpage
    140
  • Abstract
    Long-time service data as well as data from current cycle testing on electrical contact resistance have been analyzed with respect to mechanical design parameters. The importance of the pressure distribution over the contact surface was studied for a constant surface force. The mechanical stresses acting over the contact surface have been calculated by the finite-element method for the type of contact investigated. It is found that a high specific contact pressure promotes lower contact resistance and favors their long-time stability. The pressure distribution on the contact surface has a significant influence on the aging properties of the connectors studied. It was confirmed that the aging behavior is strongly affected by the preparation methods. The aging mechanisms detected on the contact surfaces studied are fretting and formation of intermetallic phases
  • Keywords
    ageing; contact resistance; design engineering; electrical contacts; environmental testing; failure analysis; finite element analysis; reliability; wear; aging behavior; aging mechanisms; aging properties; constant surface force; contact pressure; contact surfaces; current cycle testing; electrical contact performance; electrical contact resistance; finite-element method; formation of intermetallic phases; fretting; long term stability; long time service data; long-time stability; mechanical design parameters; mechanical stresses; preparation methods; pressure distribution; Aging; Connectors; Contact resistance; Electric resistance; Finite element methods; Phase detection; Stability; Stress; Surface resistance; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1989., Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/HOLM.1989.77932
  • Filename
    77932