Title :
Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350)
Abstract :
The following topics were dealt with: EMC; test and measurement; microelectronics components; thermal management; and engineering management
Keywords :
electromagnetic compatibility; integrated circuit measurement; integrated circuit testing; management; packaging; EMC; engineering management; microelectronics components; test and measurement; thermal management;
Conference_Titel :
Electro/99 Technical program, 1999. Proceedings of the
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5475-3
DOI :
10.1109/ELECTR.1999.779325
