• DocumentCode
    2985829
  • Title

    The corrosion of copper and porous gold in flowing mixed gas environments

  • Author

    Abbott, W.H.

  • Author_Institution
    Battelle, Columbus, OH, USA
  • fYear
    1989
  • fDate
    18-20 Sep 1989
  • Firstpage
    141
  • Lastpage
    146
  • Abstract
    Experiments were conducted on the corrosion of materials in a broad variety of single-component and multicomponent flowing mixed gas environments. One purpose of the experiments was to document in a consistent manner the corrosion rates and effect which can be expected for different gas mixtures. A second objective was to demonstrate the importance of standardized control materials for documenting environmental tests. The results confirm that flowing mixed gas environments based upon the use of the sulfide-chloride synergisms produce relevant corrosion with useful accelerator factors. Nonchloride environments were found to be relatively high. Two materials were demonstrated to be useful for documenting the conditions actually obtained during environmental tests. These are copper and porous gold. Neither alone can present an adequate descriptor of the test conditions actually achieved. Used together, however, they can provide a sensitive indicator of corrosion rates and mechanisms
  • Keywords
    copper; corrosion testing; environmental testing; gold; life testing; reliability; Cu corrosion; accelerator factors; corrosion of materials; corrosion rates; documenting environmental tests; environmental tests; flowing mixed gas environments; gas mixtures; multicomponent flowing mixed gas; porous Au corrosion; sensitive indicator of corrosion rates; single gas environment; standardized control materials; Acceleration; Conducting materials; Contacts; Copper; Corrosion; Gold; Laboratories; Life estimation; Materials testing; Pollution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1989., Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/HOLM.1989.77933
  • Filename
    77933