New type of large-area a-Si module produced using a polymer encapsulation method

Author

Hayashi, Katsuhiko ; Ishikawa, Atsuo ; Endho, Toshihito ; Yamagish, Hideo

Author_Institution

Labs. of Electron. Mater. Res., Kaneka Corp., Shiga, Japan

Volume

1

fYear

1994

fDate

5-9 Dec 1994

Firstpage

535

Abstract

A new type of amorphous silicon (a-Si) solar module has been developed, the back surface of which is encapsulated with a thermosetting polymer by using a spreading method. For this purpose, poly-olefin oligomer was chosen as an encapsulation layer and the process has been investigated. The modules show very little change in electrical performance under several types of acceleration test

Keywords

amorphous semiconductors; elemental semiconductors; encapsulation; life testing; polymers; semiconductor device testing; silicon; solar cell arrays; solar cells; Si; a-Si solar cells; acceleration test; back surface; electrical performance; large-area PV modules; poly-olefin oligomer; polymer encapsulation method; spreading method; thermosetting polymer; Conductivity; Costs; Encapsulation; Glass; Laboratories; Photovoltaic cells; Polymer films; Silicon; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on

Conference_Location

Waikoloa, HI

Print_ISBN

0-7803-1460-3

Type

conf

DOI

10.1109/WCPEC.1994.520016

Filename

520016