Title :
Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation
Author :
Tavassoli, Bahrnan
Author_Institution :
Adv. Thermal Solutions Inc., Newton, MA, USA
Abstract :
Discusses reasons for improvement. 1) More mass entering the heat sink due to a larger frontal area and hence increased heat transfer; 2) less pressure drop along the heat sink
Keywords :
ball grid arrays; cooling; forced convection; heat sinks; integrated circuit packaging; ducted flow conditions; frontal area; heat transfer; pressure drop; thermal response; ultra-performance BGA heat sink; unducted flow conditions; Fans; Heat sinks; Heat transfer; Region 2; Resistance heating; Thermal resistance;
Conference_Titel :
Electro/99 Technical program, 1999. Proceedings of the
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5475-3
DOI :
10.1109/ELECTR.1999.779351
