DocumentCode
2986337
Title
NBTI Degradation: A Problem or a Scare?
Author
Saluja, Kewal K. ; Vijayakumar, Shriram ; Sootkaneung, Warin ; Yang, Xaingning
Author_Institution
Univ. of Wisconsin-Madison, Madison
fYear
2008
fDate
4-8 Jan. 2008
Firstpage
137
Lastpage
142
Abstract
Negative bias temperature instability (NBTI) has been identified as a major and critical reliability issue for PMOS devices in nano-scale designs. It manifests as a negative threshold voltage shift, thereby degrading the performance of the PMOS devices over the lifetime of a circuit. In order to determine the quantitative impact of this phenomenon an accurate and tractable model is needed. In this paper we explore a novel and practical methodology for modeling NBTI degradation at the logic level for digital circuits. Its major contributions include i) a SPICE level simulation to identify stress on PMOS devices under varying input conditions for various gate types and ii) a gate level simulation methodology that is scalable and accurate for determining stress on large circuits. We validate the proposed logic level simulation methodology by showing that it is accurate within 1% of the reference model. Contrary to many other papers in this area, our experimental results show that the overall delay degradation of large digital circuits due to NBTI is relatively small.
Keywords
MOSFET; SPICE; digital circuits; integrated circuit design; logic circuits; semiconductor device reliability; PMOS transistor; SPICE level simulation; digital circuits; gate level simulation methodology; logic level; nano-scale designs; negative bias temperature instability degradation; negative threshold voltage; reliability issue; stress determination; Circuit simulation; Degradation; Digital circuits; Logic devices; MOS devices; Nanoscale devices; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2008. VLSID 2008. 21st International Conference on
Conference_Location
Hyderabad
ISSN
1063-9667
Print_ISBN
0-7695-3083-4
Type
conf
DOI
10.1109/VLSI.2008.43
Filename
4450493
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