• DocumentCode
    2986605
  • Title

    Analysis of Delay Variation in Encoded On-Chip Bus Signaling under Process Variation

  • Author

    Tuuna, S. ; Nigussie, Ethiopia ; Isoaho, Jouni ; Tenhunen, Hannu

  • Author_Institution
    Univ. of Turku, Turku
  • fYear
    2008
  • fDate
    4-8 Jan. 2008
  • Firstpage
    228
  • Lastpage
    234
  • Abstract
    In this paper, we model on-chip signaling over a bus consisting of encoding, drivers, transmission lines, receivers and decoding. We characterize the signaling circuitry as a function of its load capacitance. The effective load capacitance seen by a driver is derived for the decoupling method and distributed RLC transmission line models. The driver delay and rise time corresponding to the derived effective capacitance are used to derive the far-end voltage of a transmission line bus. The effects of process variation are taken into account in the characterization of the signaling circuitry and in the wire analysis. The overall delay variation of the bus due to device and wire process variation is then calculated. The model is verified by comparing it to HSPICE. We implement regular voltage mode, level- encoded dual-rail and l-of-4 signaling circuitry and apply the derived model to analyze them. The implementation and analysis are done in 45 nm technology.
  • Keywords
    delays; integrated circuit interconnections; manufacturing processes; nanotechnology; network analysis; transmission line theory; HSPICE; decoupling method; delay variation analysis; distributed RLC transmission line models; load capacitance; on-chip bus signaling; process variation; signaling circuitry; wire analysis; Capacitance; Delay; Distributed parameter circuits; Driver circuits; Encoding; RLC circuits; Signal analysis; Signal processing; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2008. VLSID 2008. 21st International Conference on
  • Conference_Location
    Hyderabad
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-3083-4
  • Type

    conf

  • DOI
    10.1109/VLSI.2008.73
  • Filename
    4450507