A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up To 80 GHz

A fully scalable and SPICE compatible wide band model up to 80 GHz of on-chip interconnects is presented in this paper. The series branch of the proposed model consists of an RL ladder network to characterize the skin and proximity effects as well as substrate skin effect. Their values are obtained from a technique based on a modified effective loop inductance model and complex image method. A CG network is used as the shunt branch of the model, which accounts for capacitive coupling through the oxide and substrate loss due to the electrical field. The values of these elements are determined by analytical formulas. The model is validated by both full-wave simulation and measurements. The simulated S-parameters of the model agree well with the measured S-parameters of on-chip interconnects with different widths and lengths over a wide frequency band from DC up to 80 GHz.