De-Embedding Considerations for High Q RFIC Inductors

In this paper, considerations for accurate de-embedding technique using the "open-thru" de-embedding methodology, aimed at de-embedding of high quality factor (Q) radio frequency integrated circuit (RFIC) inductors will be presented. In addition, proper design of on wafer ground-signal-ground-signal-ground (GSGSG) probe tip padset and de-embedding structures ("open" and "through") will be discussed. It will be shown, through EM simulations that accurate characterization of properly designed de-embedding structures results in very reliable and accurate de-embedding using the previously developed "open-thru" de-embedding method.