Vertical-Ground-Plane Transmission Lines for Miniaturized Silicon-Based MMICs

Author

Huang, Juin-Wei ; Wang, Chao-Shiun ; Wang, Chorng-Kuang ; Yeh, Shih-Huang

Author_Institution

Nat. Taiwan Univ., Taipei

fYear

2007

fDate

3-5 June 2007

Firstpage

563

Lastpage

566

Abstract

This paper presents a compact transmission line (TL) structure, which comprises one signal line surrounded by two vertical ground planes (VGPs). A V-band amplifier using VGP TLs for matching is also implemented in 130-nm CMOS technology with a peak gain of 18.3 dB at 52 GHz with a compact area of only 0.36 mm while consuming 19 mW from a 1.2-V supply. Compared to other V-band CMOS amplifiers using TLs for matching, this amplifier has the lowest power consumption and smallest chip size.

Keywords

CMOS integrated circuits; MIMIC; elemental semiconductors; millimetre wave amplifiers; silicon; CMOS amplifiers; CMOS technology; Si; V-band amplifier; compact transmission line structure; frequency 52 GHz; miniaturized silicon-based MMIC; power 19 mW; size 130 nm; vertical ground planes; vertical-ground-plane transmission lines; voltage 1.2 V; CMOS technology; Coplanar transmission lines; Coplanar waveguides; Distributed parameter circuits; MMICs; Millimeter wave technology; Power transmission lines; Silicon; Substrates; Transmission lines; Transmission line; compact passive component; monolithic microwave integrated circuit (MMIC);

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2007 IEEE

Conference_Location

Honolulu, HI

ISSN

1529-2517

Print_ISBN

1-4244-0530-0

Electronic_ISBN

1529-2517

Type

conf

DOI

10.1109/RFIC.2007.380947

Filename

4266495