DocumentCode
2988964
Title
Power-Efficient and High-Performance Multi-level Hybrid Nanophotonic Interconnect for Multicores
Author
Morris, Randy W., Jr. ; Kodi, Avinash Karanth
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Ohio Univ., Athens, OH, USA
fYear
2010
fDate
3-6 May 2010
Firstpage
207
Lastpage
214
Abstract
Network-on-Chips (NoCs) are becoming the defacto standard for interconnecting the increasing number of cores in chip multiprocessors (CMPs) by overcoming the scalability and wire delay problems of shared buses. However, recent research has shown that future NoCs will be limited by power dissipation and reduced performance forcing architects to explore other technologies that are complementary metal oxide semiconductor (CMOS) compatible. In this paper, we propose ET-PROPEL (Extended Token based Photonic Reconfigurable On-Chip Power and Area-Efficient Links) architecture to utilize the emerging nanophotonic technology to design a high-bandwidth, low latency and low power multi-level hybrid interconnect that balances cost and performance. We develop our interconnect at three levels: at the first level (x) we design a fully connected network for exploiting locality; at the second level(y), we design a shared channel using optical tokens to reduce power while providing full connectivity and at the third level (z), we propose a novel nanophotonic crossbar that provides scalable bisection bandwidth. The first two levels are combined into T-PROPEL(token-PROPEL, 64 cores) and four separate T-PROPELs are combined into ET-PROPEL (256 cores). We have simulated both T-PROPEL and ET-PROPEL using synthetic and SPLASH-2 traffic, where our results indicate that T-PROPEL and ET-PROPEL significantly reduce power(10-fold) and increase performance (3-fold) over other well known electrical and photonic networks.
Keywords
microprocessor chips; multiprocessor interconnection networks; nanophotonics; network-on-chip; optical interconnections; parallel architectures; CMOS; ET-PROPEL architecture; SPLASH-2 traffic; chip multiprocessor; complementary metal oxide semiconductor; extended token based photonic reconfigurable on-chip power and area-efficient links architecture; high-bandwidth multilevel hybrid interconnect; high-performance multi-level hybrid nanophotonic interconnect; low latency multilevel hybrid interconnect; low power multilevel hybrid interconnect; multicores; nanophotonic crossbar; nanophotonic technology; network-on-chip; optical token; power dissipation; power-efficient multi-level hybrid nanophotonic interconnect; scalable bisection bandwidth; shared buses; shared channel; synthetic traffic; CMOS technology; Delay; LAN interconnection; Multicore processing; Network-on-a-chip; Optical design; Photonics; Power dissipation; Scalability; Wire; Interconnects; Low-Power architecture; Network-on-Chip; Optoelectronic;
fLanguage
English
Publisher
ieee
Conference_Titel
Networks-on-Chip (NOCS), 2010 Fourth ACM/IEEE International Symposium on
Conference_Location
Grenoble
Print_ISBN
978-1-4244-7085-3
Electronic_ISBN
978-1-4244-7086-0
Type
conf
DOI
10.1109/NOCS.2010.30
Filename
5507544
Link To Document