• DocumentCode
    2989044
  • Title

    Physical vs. Virtual Express Topologies with Low-Swing Links for Future Many-Core NoCs

  • Author

    Chen, Chia-Hsin Owen ; Agarwal, Niket ; Krishna, Tushar ; Koo, Kyung-Hoae ; Peh, Li-Shiuan ; Saraswat, Krishna C.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Massachusettes Inst. of Technol., Cambridge, MA, USA
  • fYear
    2010
  • fDate
    3-6 May 2010
  • Firstpage
    173
  • Lastpage
    180
  • Abstract
    The number of cores present on-chip is increasing rapidly. The on-chip network that connects these cores needs to scale efficiently. The topology of on-chip networks is an important design choice that affects how these networks scale. Most current on-chip networks use 2-D mesh topologies which do not scale due to their large diameter and energy inefficiency. To tackle the scalability problem of 2-D meshes, various physical express topologies and virtual express topologies have been proposed. In addition, recently proposed link designs like capacitively driven low-swing interconnects can help lower link power and latency, and can favor these bypass designs. In this work, we compare these two kinds of express topologies under realistic system constraints using synthetic network traffic. We observe that both express topologies help reduce low-load latencies. Virtual topologies help improve throughput whereas the physical express topologies give better performance-per-watt.
  • Keywords
    multiprocessing systems; network topology; network-on-chip; bypass designs; low swing links; many core NoC; onchip networks topology; physical express topologies; virtual express topologies; Bandwidth; Computer science; Delay; Energy consumption; Network topology; Network-on-a-chip; Proposals; Scalability; System-on-a-chip; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networks-on-Chip (NOCS), 2010 Fourth ACM/IEEE International Symposium on
  • Conference_Location
    Grenoble
  • Print_ISBN
    978-1-4244-7085-3
  • Electronic_ISBN
    978-1-4244-7086-0
  • Type

    conf

  • DOI
    10.1109/NOCS.2010.26
  • Filename
    5507548