Title :
Packaging R&D in Singapore
Author :
Iyer, Mahadevan K. ; Siong, Teo Poi ; Hwa, Teo Keng ; Beng, Lim Thiam
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
Abstract :
This paper gives an overview of electronic, optical and MEMS packaging activities in Singapore from both components and microsystems perspective. A brief introduction to Singapore´s electronic sector is provided. The research and development focus and industry collaborations are discussed. The collaborations between universities and research institutes of Singapore in the areas of system integration, electro optical module development, wafer level packaging and integration and MEMS packaging are discussed.
Keywords :
electronics packaging; micromechanical devices; research and development; MEMS packaging; Singapore activities; business opportunities; components perspective; electronic packaging; electronics industry; electrooptical module development; industry collaborations; microsystems perspective; optical packaging; research and development; wafer level packaging; Assembly; Collaboration; Electronics industry; Electronics packaging; Industrial electronics; Micromechanical devices; Research and development; Semiconductor device manufacture; Semiconductor device packaging; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298686
