Title :
Highlights of the 2002 national electronic manufacturing technology roadmaps and their applicability to China
Author :
Pfahl, Robert C., Jr.
Author_Institution :
Nat. Electron. Manuf. Initiative, Herndon, VA, USA
Abstract :
This presentation describes the roadmapping process used in North America, highlights key global results of the 2002 edition, and suggests how this roadmap and the roadmap process might benefit the electronics industry in China. The 2002 national electronic manufacturing technology roadmap (NEMI, 2002) was released by NEMI on April 1, 2003. This edition of the biennial roadmap is over 1000 pages long and was produced by over 350 individuals from over 170 industrial, government, and academic institutions in North America in cooperation with SIA (Semiconductor Industry Association), IRC, IMAPS (International Microelectronics and Packaging Society), USDC (United States Display Consortium), NSIC (National Storage Industry Consortium), and OIDA (Optoelectronics Industry Development Association). It contains eighteen individual technology roadmaps covering all aspects of the global electronics industry and its supply chain.
Keywords :
electron device manufacture; electronic equipment manufacture; electronics industry; technological forecasting; Chinese electronics industry; NEMI; electronics industry supply chain; global electronics industry; national electronic manufacturing technology roadmaps; Displays; Electronics industry; Electronics packaging; Manufacturing industries; Microelectronics; North America; Semiconductor device manufacture; Semiconductor device packaging; Supply chains; US Government;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298687
