Highlights of the 2002 national electronic manufacturing technology roadmaps and their applicability to China

Author

Pfahl, Robert C., Jr.

Author_Institution

Nat. Electron. Manuf. Initiative, Herndon, VA, USA

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

24

Lastpage

29

Abstract

This presentation describes the roadmapping process used in North America, highlights key global results of the 2002 edition, and suggests how this roadmap and the roadmap process might benefit the electronics industry in China. The 2002 national electronic manufacturing technology roadmap (NEMI, 2002) was released by NEMI on April 1, 2003. This edition of the biennial roadmap is over 1000 pages long and was produced by over 350 individuals from over 170 industrial, government, and academic institutions in North America in cooperation with SIA (Semiconductor Industry Association), IRC, IMAPS (International Microelectronics and Packaging Society), USDC (United States Display Consortium), NSIC (National Storage Industry Consortium), and OIDA (Optoelectronics Industry Development Association). It contains eighteen individual technology roadmaps covering all aspects of the global electronics industry and its supply chain.

Keywords

electron device manufacture; electronic equipment manufacture; electronics industry; technological forecasting; Chinese electronics industry; NEMI; electronics industry supply chain; global electronics industry; national electronic manufacturing technology roadmaps; Displays; Electronics industry; Electronics packaging; Manufacturing industries; Microelectronics; North America; Semiconductor device manufacture; Semiconductor device packaging; Supply chains; US Government;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298687

Filename

1298687