• DocumentCode
    2989095
  • Title

    Computer aided reliability assessment

  • Author

    Wu, Ji ; Pecht, Michael ; Wang, Jiaji

  • Author_Institution
    CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    36
  • Lastpage
    39
  • Abstract
    This paper describes the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.
  • Keywords
    electronic engineering computing; electronics packaging; failure analysis; reliability; software tools; computer aided reliability assessment; design-for-reliability; electronic system virtual qualification; failure mechanism models; integrated software tools; microelectronic packages; physics-of-failure methods; Circuits; Failure analysis; Geometry; Materials testing; Military standards; Packaging; Qualifications; Robustness; Software libraries; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298689
  • Filename
    1298689
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2989095