Title :
On-chip crosstalk evaluation between adjacent interconnections
Author :
Servel, G. ; Deschacht, D.
Author_Institution :
Lab. d´´Inf. de Robot et de Microelectron., UMR CNRS, Montpellier, France
Abstract :
With the reduction of distances between wires in deep sub-micron technologies, coupling capacitances become significant. This increase of capacitance causes noise capable of propagating a logical fault. Poor evaluation of the crosstalk could be at the origin of a circuit malfunction. In this paper, we propose a new closed form expression for the crosstalk between two, three and five lines. Results given by our expression are compared with SPICE simulations for 0.25 μm technology
Keywords :
SPICE; VLSI; crosstalk; distributed parameter networks; fault diagnosis; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; 0.25 μm technology; 0.25 mum; HSPICE simulations; VLSI; adjacent interconnections; circuit malfunction; closed form expression; coupling capacitances; crosstalk voltage; deep sub-micron technologies; distributed RC model; logical fault propagation; noise; on-chip crosstalk evaluation; Capacitance; Circuit noise; Coupling circuits; Crosstalk; Integrated circuit interconnections; Inverters; Predictive models; SPICE; Voltage; Wires;
Conference_Titel :
Electronics, Circuits and Systems, 2000. ICECS 2000. The 7th IEEE International Conference on
Conference_Location :
Jounieh
Print_ISBN :
0-7803-6542-9
DOI :
10.1109/ICECS.2000.913004
