• DocumentCode
    2989154
  • Title

    Comparing Energy and Latency of Asynchronous and Synchronous NoCs for Embedded SoCs

  • Author

    Gebhardt, Daniel ; You, Junbok ; Stevens, Kenneth S.

  • Author_Institution
    Sch. of Comput., Univ. of Utah, Salt Lake City, UT, USA
  • fYear
    2010
  • fDate
    3-6 May 2010
  • Firstpage
    115
  • Lastpage
    122
  • Abstract
    Power consumption of on-chip interconnects is a primary concern for many embedded system-on-chip (SoC) applications. In this paper, we compare energy and performance characteristics of asynchronous (clockless) and synchronous network-on-chip implementations, optimized for a number of SoC designs. We adapted the COSI-2.0 framework with ORION 2.0 router and wire models for synchronous network generation. Our own tool, ANetGen, specifies the asynchronous network by determining the topology with simulated-annealing and router locations with force-directed placement. It uses energy and delay models from our 65 nm bundled-data router design. SystemC simulations varied traffic burstiness using the self-similar b-model. Results show that the asynchronous network provided lower median and maximum message latency, especially under bursty traffic, and used far less router energy with a slight overhead for the inter-router wires.
  • Keywords
    embedded systems; network-on-chip; performance evaluation; power consumption; ANetGen; COSI-2.0 framework; ORION 2.0 router; SystemC simulations; asynchronous NoC; embedded system-on-chip applications; force-directed placement; performance characteristics; power consumption; router locations; simulated-annealing; synchronous NoC; wire models; Clocks; Delay; Design optimization; Energy consumption; Network-on-a-chip; Power system interconnection; System-on-a-chip; Telecommunication traffic; Traffic control; Wire; CAD; EDA; GALS; NoC; SoC; asynchronous; floorplan; network; router; topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networks-on-Chip (NOCS), 2010 Fourth ACM/IEEE International Symposium on
  • Conference_Location
    Grenoble
  • Print_ISBN
    978-1-4244-7085-3
  • Electronic_ISBN
    978-1-4244-7086-0
  • Type

    conf

  • DOI
    10.1109/NOCS.2010.21
  • Filename
    5507554