Title :
Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm
Author :
Li, Quanyong ; Gong, Yubing ; Yang, Daoguo ; Liang, Junsheng
Author_Institution :
Center of Micro-electric Package & Assembly Technol., Guilin Univ. of E1ectronic Technol., China
Abstract :
In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.
Keywords :
circuit optimisation; design of experiments; finite element analysis; flip-chip devices; genetic algorithms; integrated circuit packaging; response surface methodology; Ant algorithm; FEM; approximate function; design of experiment; equivalent stress; flip chip package parameters; numerical simulation; random heuristic algorithm; response surface method; simulation-based optimization; solder joints; Algorithm design and analysis; Analytical models; Assembly; Electronics packaging; Flip chip; Iron; Silicon; Soldering; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298698
