Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

Author

Li, Quanyong ; Gong, Yubing ; Yang, Daoguo ; Liang, Junsheng

Author_Institution

Center of Micro-electric Package & Assembly Technol., Guilin Univ. of E1ectronic Technol., China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

86

Lastpage

90

Abstract

In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.

Keywords

circuit optimisation; design of experiments; finite element analysis; flip-chip devices; genetic algorithms; integrated circuit packaging; response surface methodology; Ant algorithm; FEM; approximate function; design of experiment; equivalent stress; flip chip package parameters; numerical simulation; random heuristic algorithm; response surface method; simulation-based optimization; solder joints; Algorithm design and analysis; Analytical models; Assembly; Electronics packaging; Flip chip; Iron; Silicon; Soldering; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298698

Filename

1298698