The design and fabrication techniques of multilayer substrate for MCM-C

With the rapid development of semiconductor industry, the scale of IC becomes larger and larger the speed of chip higher and higher, and the volume of package smaller and smaller. To meet the challenge, Multi-Chip Module (MCM) must be developed simultaneously, which makes a module with many single chips, reduces the cost of circuit, and improves the performance of circuit. MCM ceramic substrate is an important part of MCM. We have developed a series of multilayer substrates for MCM-C. This paper presents our design and fabrication techniques of MCM ceramic substrate, includes modeling, library, routing, simulation, part, co-firing, and plating technologies, and introduces the information of our MCM-C substrates.