Title :
Design and control of horizontal extension for gold bumping
Author :
Wang, Shuidi ; Hu, Tao ; Cai, Jian ; Jia, Songliang
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
Gold bump is commonly used for COG (chip on glass) packaging of LCD driver. The market of Au bump COG is growing fast. Mostly, the gold bumping is finished on the whole wafer, following the process of UBM sputtering, thick photoresist patterning, electric gold plating, etc. Gold bumps with 10/spl sim/30 /spl mu/m in height, 45/spl sim/70 /spl mu/m in pitch and 15/spl sim/25 /spl mu/m in space have been fabricated. Horizontal extension should be controlled during bumping. Design and process optimization have been done to get high quality Au bumps.
Keywords :
driver circuits; electroplating; flip-chip devices; gold; integrated circuit packaging; liquid crystal displays; Au; LCD driver; chip on glass packaging; design optimization; electroplating; gold bumping; horizontal extension; process optimization; Bonding; Design optimization; Glass industry; Gold; Lithography; Microelectronics; Mobile handsets; Packaging; Resists; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298702
