DocumentCode
2989399
Title
Design and control of horizontal extension for gold bumping
Author
Wang, Shuidi ; Hu, Tao ; Cai, Jian ; Jia, Songliang
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
105
Lastpage
109
Abstract
Gold bump is commonly used for COG (chip on glass) packaging of LCD driver. The market of Au bump COG is growing fast. Mostly, the gold bumping is finished on the whole wafer, following the process of UBM sputtering, thick photoresist patterning, electric gold plating, etc. Gold bumps with 10/spl sim/30 /spl mu/m in height, 45/spl sim/70 /spl mu/m in pitch and 15/spl sim/25 /spl mu/m in space have been fabricated. Horizontal extension should be controlled during bumping. Design and process optimization have been done to get high quality Au bumps.
Keywords
driver circuits; electroplating; flip-chip devices; gold; integrated circuit packaging; liquid crystal displays; Au; LCD driver; chip on glass packaging; design optimization; electroplating; gold bumping; horizontal extension; process optimization; Bonding; Design optimization; Glass industry; Gold; Lithography; Microelectronics; Mobile handsets; Packaging; Resists; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298702
Filename
1298702
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