Simulation and optimization of solution flow in fountain-plating cup for Au bumping

Author

Hu, Tao ; Wang, Shuidi ; Wang, Haining ; Cai, Jian ; Jia, Songliang

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

110

Lastpage

114

Abstract

A fountain-plating cup is designed and fabricated in IMETU (Institute of Microelectronics, Tsinghua University). The simulation and optimization of solution flow in the cup by computational fluid dynamics (CFD) tool have been introduced in this paper. The structure of the plating cup is presented and the position, the thickness and the hole size of the diffuser and the velocity of flow at entrance are used as the parameters for simulation. With the results of the simulation, Au bumps with tolerance in /spl plusmn/2.5 /spl mu/m on a 6 inch wafer have been fabricated.

Keywords

circuit optimisation; computational fluid dynamics; driver circuits; flip-chip devices; gold; integrated circuit bonding; integrated circuit packaging; Au; LCD driver chip bonding; computational fluid dynamics; diffuser hole size; flip chip technology; fountain-plating cup; gold bumping; high reliability; high yield; optimization; simulation; solution flow; vertical fountain plating equipment; Computational fluid dynamics; Consumer products; Electrodes; Flip chip; Glass; Gold; Microelectronics; Packaging; Resists; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298703

Filename

1298703