Title :
Simulation and optimization of solution flow in fountain-plating cup for Au bumping
Author :
Hu, Tao ; Wang, Shuidi ; Wang, Haining ; Cai, Jian ; Jia, Songliang
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
A fountain-plating cup is designed and fabricated in IMETU (Institute of Microelectronics, Tsinghua University). The simulation and optimization of solution flow in the cup by computational fluid dynamics (CFD) tool have been introduced in this paper. The structure of the plating cup is presented and the position, the thickness and the hole size of the diffuser and the velocity of flow at entrance are used as the parameters for simulation. With the results of the simulation, Au bumps with tolerance in /spl plusmn/2.5 /spl mu/m on a 6 inch wafer have been fabricated.
Keywords :
circuit optimisation; computational fluid dynamics; driver circuits; flip-chip devices; gold; integrated circuit bonding; integrated circuit packaging; Au; LCD driver chip bonding; computational fluid dynamics; diffuser hole size; flip chip technology; fountain-plating cup; gold bumping; high reliability; high yield; optimization; simulation; solution flow; vertical fountain plating equipment; Computational fluid dynamics; Consumer products; Electrodes; Flip chip; Glass; Gold; Microelectronics; Packaging; Resists; Wafer bonding;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298703
