DocumentCode
2989440
Title
A study of metallization processing ceramic package
Author
Qingshui, Xia ; Chuanzheng, Tu ; Kai, Cheng ; Luning, Wang ; Liang, Fan Zheng
Author_Institution
No.55 Inst. of China Electrics Technol. Group Corp., China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
117
Lastpage
120
Abstract
This paper introduces the metallization process in ceramic package and discusses some important factors in the process.
Keywords
ceramic packaging; metallisation; sintering; thick films; airtightness; ceramic package; green ceramic; high-reliability high-power electronic devices; metal powder sintering; metallization process; multilayer ceramic; screen printing machine; Ceramics; Electronic packaging thermal management; Electronics packaging; Filling; Humidity; Metallization; Powders; Printing; Protection; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298705
Filename
1298705
Link To Document