Design of laser scanning solder bumping system

Author

Zhang, Xiaodong ; Wang, Chunqing ; Tian, Yanhong

Author_Institution

State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

141

Lastpage

144

Abstract

In this paper, various laser scanning methods were presented. A new and promising laser scanning method was discussed, and the principle of the laser scanning reflow system was illustrated. With this system, laser scanning reflow experiments of PBGA solder balls were carried out. Results of experiments showed that laser scanning reflow of PBGA solder balls could be realized with a wide parameter window. The formation of the solder bump is strongly influenced by laser input energy. With proper laser input energy, solder bumps with a smooth surface, high shear strength and fine microstructure could be obtained.

Keywords

ball grid arrays; crystal microstructure; integrated circuit packaging; laser materials processing; plastic packaging; reflow soldering; shear strength; surface texture; PBGA solder balls; laser input energy; laser scanning reflow system; laser scanning solder bumping system; microstructure; shear strength; smooth bump surface; solder bump formation; Electronics packaging; Focusing; Laser beams; Laser theory; Microstructure; Optical design; Optical modulation; Soldering; Surface emitting lasers; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298710

Filename

1298710