Title :
Developments and trends in stacked die CSPs
Author :
Vardaman, E. Jan
Author_Institution :
TechSearch Int., Inc., Austin, TX, USA
Abstract :
With increased demand for small form factor packages for portable products there has been increased demand for dense packaging. Stacking dice inside the CSP is one solution. This presentation focuses on CSPs with multiple dies stacked inside.
Keywords :
chip scale packaging; dense packaging; multiple stacked die package; portable products; small form factor packages; stacked die CSP; Assembly; Bonding; Chip scale packaging; Microelectronics; Mobile handsets; Random access memory; Semiconductor device packaging; Stacking; Substrates; Wire;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298711
