DocumentCode
2989676
Title
Structure Design and Fabrication of an Area-changed Bulk Micromachined Capacitive Accelerometer
Author
Bais, Badariah ; Majlis, Burhanuddin Y.
Author_Institution
Univ. Kebangsaan Malaysia, Bangi
fYear
2006
fDate
Oct. 29 2006-Dec. 1 2006
Firstpage
29
Lastpage
34
Abstract
In this paper, a lateral capacitive MEMS accelerometer for low-g applications was designed and fabricated. The accelerometer is chosen to be based on an area-changed detection scheme. Area-changed accelerometers can provide alternatives in designing high sensitivity and low mechanical noise floor sensors as it is capable of providing a large proof mass. Based on the calculation of sensitivity and basic resonance frequency, three kinds of accelerometers were designed and optimized. Bulk silicon is chosen as the proof mass material and a three-mask micromachining technology was adopted to fabricate the active structures of the accelerometer. Deep RIE and wafer bonding techniques are utilized as it offers solutions in fabricating the thick proof mass and high aspect ratio sensing element structures with small sensing gaps to achieve high sensitivity and low noise performance.
Keywords
accelerometers; capacitive sensors; micromachining; micromechanical devices; sputter etching; wafer bonding; area-changed bulk micromachined capacitive accelerometer; deep RIE; lateral capacitive MEMS accelerometer; low-g applications; three-mask micromachining technology; wafer bonding techniques; Accelerometers; Design optimization; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Resonance; Resonant frequency; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-9730-4
Electronic_ISBN
0-7803-9731-2
Type
conf
DOI
10.1109/SMELEC.2006.381014
Filename
4266564
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