• DocumentCode
    2989698
  • Title

    Laser bonding and packaging of plastic microfluidic chips

  • Author

    Lai, Jianjun ; Chen, Xiqu ; Wang, Xuefang ; Yi, Xinjian ; Liu, Sheng

  • Author_Institution
    Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    168
  • Lastpage
    171
  • Abstract
    Plastics-based microfluidic and other microanalytical platforms have a great potential in bioMEMS applications, because many plastics are low cost and biocompatible, and have good processibility, compared with silicon and/or glass based biochips. To achieve terminal product bonding and packaging is a challenging issue in the fabrication of these plastic platforms. Conventional bonding and packaging methods have aroused problems like high temperature, high voltage, vibration damage or adhesive pollution. In this paper. a new bonding technology based on transmission laser welding plastics is introduced to the field of plastics chips packaging. Principle, experimental set-up and initial result are given to show characteristics of this technology.
  • Keywords
    bonding processes; laser beam welding; microfluidics; plastic packaging; bioMEMS; laser bonding; laser packaging; plastic microfluidic chips; terminal product bonding; transmission laser welding; Bonding; Costs; Glass; Microfluidics; Optical device fabrication; Plastic packaging; Pollution; Silicon; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298717
  • Filename
    1298717