DocumentCode
2989698
Title
Laser bonding and packaging of plastic microfluidic chips
Author
Lai, Jianjun ; Chen, Xiqu ; Wang, Xuefang ; Yi, Xinjian ; Liu, Sheng
Author_Institution
Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
168
Lastpage
171
Abstract
Plastics-based microfluidic and other microanalytical platforms have a great potential in bioMEMS applications, because many plastics are low cost and biocompatible, and have good processibility, compared with silicon and/or glass based biochips. To achieve terminal product bonding and packaging is a challenging issue in the fabrication of these plastic platforms. Conventional bonding and packaging methods have aroused problems like high temperature, high voltage, vibration damage or adhesive pollution. In this paper. a new bonding technology based on transmission laser welding plastics is introduced to the field of plastics chips packaging. Principle, experimental set-up and initial result are given to show characteristics of this technology.
Keywords
bonding processes; laser beam welding; microfluidics; plastic packaging; bioMEMS; laser bonding; laser packaging; plastic microfluidic chips; terminal product bonding; transmission laser welding; Bonding; Costs; Glass; Microfluidics; Optical device fabrication; Plastic packaging; Pollution; Silicon; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298717
Filename
1298717
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